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Spatial Atomic Layer Deposition

SALD Technology

What is Spatial Atomic Layer Deposition?

Spatial Atomic Layer Deposition (Spatial ALD) is an atmospheric, form-following, high-quality coating method at atomic level and with a self-limiting reaction mechanism. Due to the high uniformity and conformality this fast coating technique provides new capabilities and improved performance. Compared with temporal ALD, this ingenious technology stacks atomic layers many times faster.

Maximum throughput at the lowest possible costs, improved functionality, efficiency and sustainability, material reduction, and longer life span are some of the added values Spatial ALD brings. Our in-depth expertise in Spatial ALD technology, combined with the unique ability to transfer it fast from lab to high-volume production, offers you excellent opportunities in today’s growth markets.

  • Maximum throughput
  • Lowest possible costs
  • Efficient use of material
  • High quality coatings
  • Roll-to-roll and sheet-to-sheet compatible
  • Continuous atmospheric process

The differences

Temporal ALD vs Spatial ALD

Temporal ALD

  • High-quality 3D layers and suitable for porous substrates.
  • Limited deposition speed
  • Limited in maximum substrates

Spatial ALD

  • High-quality 3D layers and suitable for porous substrates.
  • 100 times faster deposition speed than conventional ALD by our spatial technology in combination with proprietary plasma enhanced deposition
  • Scalable to large areas & flexible substrates
  • Industrially proven, cost-efficient mass production.

SALD Technology

How does Spatial Atomic Layer Deposition operate?

Atmospheric pressure Spatial ALD operates by simultaneously delivering precursor and co-reactant gases from separate sources separated by a gas curtain onto a substrate which moves though the different gas zones. In the gas zones the gasses react on the substrate surface in a self-limiting manner to achieve controlled and efficient thin film deposition. This unique self-limited growth mechanism ensures precise control over film thickness and composition, making Spatial ALD ideal for industrial applications requiring uniform coatings on complex substrates. We have developed the deposition technology making it compatible with sheet-to-sheet (S2S) and Roll-to-Roll deposition.

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Atomic Layer Deposition

ALD: In ALD, precursor gases are sequentially pulsed into a reaction chamber, where they react with the substrate surface in a self-limiting manner, forming a monolayer of material.
Spatial ALD, utilizes spatial separation of precursor sources and substrate, allowing for simultaneous exposure of the substrate to multiple precursor gases without the need for sequential pulsing.

Higher throughput and scalability. Spatial ALD is potentially more scalable for large-area coating applications due to its higher throughput and simple integration in production lines.

By eliminating the need for sequential pulsing, a time-intensive process, Spatial ALD reduces cycle times for deposition leading to higher throughput. For example, for ALD of Al2O3 the deposition rate can increase from 100-300 nm per hour to 60 nm per minute when employing Spatial ALD.

Yes, Spatial ALD allows for the growth of complex multi-component materials by either co-dosing or super cycling the different precursors.

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